Advafab
Advafab (former Advacam Oy) is the leading semiconductor solution provider of high-quality pixel detector module products and radiation sensor manufacturing and semiconductor integration services. The company’s business model is to provide a turn-key solution for its customers in the industrial and academic imaging or spectroscopic markets. Advafab is a technology spin-off company from VTT Technical Research Centre of Finland. The company was founded in 2012 by Juha Kalliopuska (CEO) and Sami Vahanen (CTO, Chairman) to solve the liability issue in the complex supply chain for producing pixel sensor modules. The company has been organically grown without external investments besides public funding within EU. Advafab has its headquarters in Jätkäsaari, Helsinki where it also has the backend clean room production facility for flip chip bonding and electrical testing. The wafer-level processing (i.e, sensor fabrication and wafer bumping) is done at Micronova facility in Otaniemi, Espoo. The team consists of highly educated experts. There are 6 people with doctors’ degree and 4 people with graduate degrees in a team of 20 people. We are a group of experts working in the fabrication and packing of radiation sensors and we master all the sub-steps of the process.
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19
11 to 50 range
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Decision-makers and verified team members
14 contacts with verified email or phone · masked until revealed.
- JM
Jussi Marles
Production Unit Manager · Manufacturing & Production
EmailPhone - MI
Mikko Ilosalo
Process Technician · Manufacturing & Production
EmailPhone - SH
Saman Hoshian
Technical Team Member · Information Technology
EmailPhone - VG
Volodymyr Gnatyuk
Senior Research Scientist · Other
EmailPhone - AB
Amal Bhandari
Flip Chip Bonding, Process Engineer (Advanced Semiconductor Packaging) · Other
EmailPhone - DN
Dmytro Nalyvaiko
,, · Other
EmailPhone - JK
Juha Kalliopuska
- Ö · Other
EmailPhone - SV
Sami Vähänen
Chief Technology Officer · Information Technology
EmailPhone
Showing 8 of 14 verified contacts
Top roles at Advafab
12 distinct titles indexed · top 10 shown.
- 2chief technology officer
- 1,,
- 1- ö
- 1administrative assistant
- 1flip chip bonding operator
- 1flip chip bonding, process engineer (advanced semiconductor packaging)
- 1microfabrication process technician
- 1process technician
- 1production unit manager
- 1senior research scientist
- +2more titles
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