Apt Co.,ltd

AP Technology Corporation is the most quality IC assembly and Module assembly services subcontractor for quick-turn prototypes, small and medium size production lots, as well as full production volumes for the special devices. By expertise with long experience in semiconductor package assembly, We offer full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, wire bond, package sealing and marking. Our assembly capabilities include Ceramic Packages, Custom Packages, Plastic packages, Open Cavity Packages, BGA, RFID, MEMS and Photonic Packages as well as SIP/MCM module, SCM ( Solar Cell Module ), LED module and specialty module. Our customer applications include Medical Systems, Telecommunications, Military and Aerospace, Computer and Wireless products.