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VerifiedSemiconductor Manufacturing

Asmpt Amicra

Ultra Precision Die Attach, High Speed Wafer Inking and inspection, High Speed Dispense System and Custom Solutions and more! At ASMPT AMICRA, we provide our valued customers with extraordinary, high-technological engineering services, including die and flip chip bonders as well as products for the entire industry field of microelectronics, including: active optical cable, fan-out, TSV, TCB, process development, semiconductor backend, fiber optic, LED, optoelectronics and MEMS. With our latest technology for die bonders and flip chip bonders we are able to optimize your bond process to reduce the cost of back-end packaging. Our company is headquartered in beautiful Regensburg, Bavaria, Germany.

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Verified contacts

58

available on Kipplo

LinkedIn employees

81

51 to 200 range

Open roles

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Distinct roles

48

indexed titles

Tech stack

0

tools in use

Monthly traffic

43

organic / mo

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Top roles at Asmpt Amicra

48 distinct titles indexed · top 10 shown.

  • 7application engineer
  • 2accountant
  • 2it leiter
  • 2mechanical design engineer
  • 2software engineer
  • 1costumer project manager
  • 1customer project manager
  • 1customer support
  • 1deputy head of application team
  • 1deputy head of purchasing
  • +38more titles

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