VerifiedSemiconductor Manufacturing· Founded 2021

Chipletz

Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that meets the rising demand for compute performance by providing denser computing capability with better power delivery. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, and high-performance computing.

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Bee Cave, United States23(11 to 50)2021chipletz.com LinkedIn

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17

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LinkedIn employees

23

11 to 50 range

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13

indexed titles

Tech stack

2

tools in use

Monthly traffic

3

organic / mo

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Top roles at Chipletz

13 distinct titles indexed · top 10 shown.

2lead packaging design engineer
1()
1, -
1chief technology officer & co-founder
1co-founder - vp product engineering
1lead si pi engineer
1member of technical staff
1packaging design engineer
1program manager
1student at university of illinois urbana-champaign
+3more titles

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