Ciposa Sa, Micro-Assembly Automation

The photonics market is characterized by a long time-to-market for new products, ranging from one to two years, while the lifespan of these products is often less than three years. To address the challenges faced in manufacturing such products, Ciposa draws on the modularity of these standard platforms to provide specific solutions. µ-Assembly The complexity of automated µ-assembly processes requires very high precision in motion control and resolution. To minimize influencing variables, Ciposa integrates metrology and bonding capability directly into its micromanipulators, creating a unique tool for measurement, alignment and bonding of optical components in an integrated manner. This compact configuration also allows for active alignment in confined workspaces. Passive and active alignment Over the past 15 years, Ciposa has built its expertise and reputation in automatic passive alignment for a variety of applications, achieving micrometer-level accuracy. To further enhance this expertise and meet the needs of the photonics market, Ciposa is now proud to introduce active alignment capabilities, improving positioning accuracy to the sub-micrometer scale. Ciposa has developed advanced algorithms tailored to metrology signals, such as optical power and two-dimensional intensity profiles. For demanding applications like fiber attachment to photonic integrated circuits (PICs) or laser assembly, Ciposa now offers automated system design and manufacturing services to enable precise and rapid optical assembly, supported by optimized tools and modular algorithm strategies.