Digital Go Microwave, Inc

Modeling and Design Capabilities • RF Integration System, Signal Integrity and microwave circuit analysis, optimization and tuning up to 40 Gb/s a to 80 Ghz a) SI, RF and electromagnetic simulation & modeling design tools 1) Designer/ADS, HFSS, SIwave, LinPar, CST and Momentum • Three dimentional transitions a) MMIC chip and components interconnection (wire bond, flip-chip, TAB, SMT components) b) Multi-layer transmission lines and RF via transitions, BGA/LGA transitions, flip-chip c) RF connectors and transitions, microwave components d) Cavity RF transitions, mitigation cavity resonance, leakage analysis, isolation e) Integrated models of combined transitions f) DC power supply bias and decoupling network analysis g) Power/ground plane analysis Layout Design tools • Route, Layout and mechanical drawing a) Sigrity UPD, AutoCAD LT and Solidworks Verification and measurements • Three dimentsional probe station • Correlation of models and measurements • Prototyping characterization Packaging technologies • Selection of Materials and substrate technologies a) Low cost substarte (FR4, BT, Nelco and Getek) b) Multi-layer high temperature co-fired ceramis (HTCC) and low temperature co-fired ceramics (LTCC) c) Organic substartes, including build up technologies