Dynamic Process Group, Inc
Dynamic Process Group, Inc.(DPG) is a Silicon Valley–based semiconductor process service provider specializing in precision wafer coring, resizing, edge grinding, and laser micromachining. Our operations and advanced Synova Laser MicroJet and Keyence MD-X 1064 nm systems allow us to handle high-value SOI, GaAs, InP, Si, and exotic materials with unmatched quality. We support universities, photonics startups, and leading semiconductor R&D teams that rely on our expertise to safely process materials from suppliers like SOITEC, Shin-Etsu, and SUMCO. Contact us to discuss your next wafer modification or R&D prototype project.
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