Enachip

Compute is no longer limited by logic. It is limited by power. EnaChip is developing integrated magnetic structures that convert voltage at the point of load — with greater efficiency, density, and scale. Our platform moves power delivery from discrete board-level components to package and chip-level integration, removing one of the most fundamental constraints on compute progress. We work at the intersection of materials science, semiconductor processing, and system architecture — building a platform, not a single component. EnaChip's technology is designed for AI infrastructure, advanced packaging, chiplets, and compact edge systems where power density and proximity to the load increasingly determine system performance. Our approach uses semiconductor-compatible electroplating processes to fabricate high-performance magnetic structures that integrate directly into PMIC or IVR packages — and ultimately within heterogeneous integrated AI modules — at lower cost and at scale. Backed by Stata Capital, Anzu Partners, and Boston Seed Capital, and led by a team with deep roots in semiconductor packaging, power magnetics, and MEMS research, EnaChip is building the magnetic layer that allows compute, packaging, and power to be designed as one system. Power delivery should scale with performance — not limit it.