Finarmodule

Finar Technology provides a rock solid, cheap, reliable solution to POWER DEVICE PACKAGING that transcends size and power density parameters. In a simple greener process we can obtain Rth j-hs of -70% and a potential reduction in BOM of 30%! Using stable and traditional materials FM Tech allows new, rational and easy configurations that not only lead to cost saving design and construction but also inherent robustness through our TEC matching technology. In a nutshell our technology enables you to get more power performance or smaller chips (therefore at lower cost) providing higher power densities all with greater robustness!