High Density Packaging User Group

HDP User Group is a project-oriented industry consortium addressing the integration of new electronics component packaging and interconnect technologies into member company supply chains. Our mission is to drive innovations in the electronics industry, reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of our members. Projects focus on: • New design and manufacturing processes, including higher copper density technologies and new reliability assessment methods. • Sustainability and environmentally friendly products, especially Pb-free solders and new high-speed materials. • Active participation of companies across the electronics supply chain with global membership. HDP has successfully brought electronics producers and suppliers together to collaboratively solve component packaging and interconnect challenges since 1993, helping our members to evaluate enabling technologies more cost effectively than doing it alone.