Hycom Core
HyCom Core is introducing a solution that revolutionizes data centers and data transfer technology. The future of data transfer lies in our xPU Connectivity Platform. This innovative technology is the result of extensive industrial experimentation and cutting-edge research in emerging thick Si-Photonics and new electro-optic waveguide technologies.
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Mousumi Chakraborty
Junior Nanofabrication Engineer · Engineering
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Rizwan Ali
Senior Nanofabrication Engineer · Engineering
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