Ieee Itherm

Sponsored by the Electronics Packaging Society (EPS), ITherm is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm is held along with the Electronic Components and Technology Conference a premier electronics packaging conference. In addition to paper presentations and vendor exhibits, ITherm includes panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition. All papers are peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking #ITherm