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VerifiedSemiconductor Manufacturing

Inpack- Ic Packaging

iNPACK goes beyond design limits to offer you cutting edge semiconductor and electronics assembly, testing and IC package design including LGA, BGA and 2D & 3D customized solutions. Featuring fully supported automated processes, MW microelectronics assemblies, System-in-Package (SiP) & heterogeneous integration. We also offer high level expertise in organic substrate design and manufacturing based on advanced materials, subtractive and mSAP processes.

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HeadquartersOcean Township, United StatesEmployees12(51 to 200)Websitepcb-technologies.comLinkedIn profileLinkedIn

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51 to 200 range

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4 distinct titles indexed · top 4 shown.

  • 1director of business development
  • 1global sales manager
  • 1machine operator
  • 1project engineer

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