Jiaco Instruments

JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control. Our application range includes- HAST, HTS, TMCL stressed Cu, PdCu, Au, Ag wire packages - Silver wire packages (new)- Wafer Level Chip Scale Package (WLCSP)(new)- High Tg mold compound (new)- Film Over Wire (FOW)(new)- Chip on Board (new)- Electrical Overstress (EOS) failure sites - Surface contamination and corrosion - Wedge bonds exposure - 3D stacked-die IC package - Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices (new)- System in Package (SiP)(new)- Localized decapsulation (new)- Sensors with transparent mold compound (new)- Bond Over Active Circuit (BOAC) with exposed copper metallization (new)- Redistribution Layer (RDL) with PBO and copper metallization (new) Other applications under R&D