Link-Us Co.,ltd

Revolutionizing Bonding with the World's Only "Ultrasonic Complex Vibration" Technology Link-US Co, Ltd. is the pioneer of the world's only patented "Ultrasonic Complex Vibration Bonding" technology. We provide innovative bonding solutions that overcome the limitations of conventional ultrasonic and thermal bonding methods. Our technology enables direct bonding of dissimilar metals at room temperature without any intermediates (solder, adhesives, or bolts), ensuring high reliability and conductivity. Key Advantages: World’s Only Technology: Our patented Complex Vibration system utilizes an elliptical vibration locus, distinct from conventional linear vibration. Zero Damage & Low Static Pressure: Bonds delicate components (like FPCs and semiconductors) without thermal stress or physical damage. Room Temperature & Direct Bonding: Joins dissimilar materials (e.g, Copper to Aluminum) directly, without heat or intermediate layers. Proven Track Record: Widely adopted in advanced manufacturing sectors, including EV battery terminals/busbars and semiconductor power modules. We are committed to contributing to the evolution of next-generation mobility and electronics through our groundbreaking joining technology: EV : FPC EV: IGBTFPC EV