VerifiedSemiconductor Manufacturing

Pactech - Packaging Technologies

Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany. Mother company: Nagase & Co, Ltd. with headquarters in Tokyo, Japan Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia

7-day free trial · no credit card

98(201 to 500)pactech.com LinkedIn

Verified contacts

51

available on Kipplo

LinkedIn employees

98

201 to 500 range

Open roles

—

no listings

Distinct roles

40

indexed titles

Tech stack

2

tools in use

Monthly traffic

387

organic / mo

Sign up free to see all 51 verified contacts at Pactech - Packaging Technologies

Free for 7 days · 50 credits · no card · only pay for verified records.

Decision-makers and verified team members

51 contacts with verified email or phone · masked until revealed.

Sign up free →

Showing 9 of 51 verified contacts

Top roles at Pactech - Packaging Technologies

40 distinct titles indexed · top 10 shown.

3administrative assistant
2design engineer
2field services engineer
2human resources executive
2process engineer
2software engineer
1assistant
1assistentin der geschäftsführung
1associate maintenance engineer
1customer quality engineer
+30more titles

Sign up to unlock all 51 contacts at Pactech - Packaging Technologies

Free for 7 days · 50 credits · no card · only pay for verified records.

Sign up to reveal 51 verified contacts at Pactech - Packaging Technologies

7-day trial · no credit card · cancel anytime · only pay for verified records.

Sign up free See pricing

Trusted by sales, marketing, and GTM engineering teams.

Pactech - Packaging Technologies | Kipplo Discover