Qp Technologies

QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our facility is AS9100D, ISO 9001:2015, ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in. Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and CoB. Contact us directly at moreinfo@qptechnologies.com