Quick Intelligent Equipment Co.,ltd

QUICK, established in 1993, aims to be your global partner and your preferred destination for precision electronics assembly and backend semiconductor packaging solutions. In order to create value for our clients, we focus on our customers' specific demands and application requirementswhere reliability, high quality products, technical expertise, and application knowledge are important. Our reputation for excellence has been established through many years of successful business cases and equipment deployments. Products of noteworthy innovation include: multifunctional die bonder, eutectic die bonder, Ag sintering, formic acid soldering, laser soldering, selective soldering, laser marking, 3D AOI and integrated automation solutions.