Ram Innovations

RAM Innovations develops and manufactures next-generation packaging solutions for the semiconductor and electronics industries. We specialise in heterogeneous PCB embedded die packaging (EDP), collaborating with world-leading partners in semiconductor and materials development. Our technology is proven through the design and manufacture of advanced power conversion modules, delivering lower parasitics, improved thermal performance, and scalable panel-level production. We are a fast-growing business and always keen to connect with talented individuals who want to make an impact in this rapidly evolving sector. If you’re interested in joining our team, please send us your CV and a short message.