Six Sigma
The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance. Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form. Testing includes: solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency. Products include BGA preforms for ball attach or reballing.
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Verified contacts
10
available on Kipplo
LinkedIn employees
99
51 to 200 range
Open roles
—
no listings
Distinct roles
9
indexed titles
Tech stack
0
tools in use
Monthly traffic
—
organic / mo
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Decision-makers and verified team members
10 contacts with verified email or phone · masked until revealed.
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Top roles at Six Sigma
9 distinct titles indexed · top 9 shown.
- 1deputy medical director
- 1diseñador gráfico
- 1general manager operations-sales-engineering
- 1materials engineer
- 1merchandising assistant
- 1plant manager
- 1quality engineer
- 1senior consultant
- 1welder fabricator
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Trusted by sales, marketing, and GTM engineering teams.