Tecnisco, Ltd logo
VerifiedSemiconductors· Founded 1970

Tecnisco, Ltd

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding. In particular, our processing (technology) are using at the following fields- Structured glass wafers for MEMS packaging - Glass micro fluidic for Drug discovery and Chemical reaction - Customized heatsinks for Laser Diode and LED We support your design and manufacturing with our Cross-edge technologies.

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HeadquartersTokyo, JapanEmployees15(201 to 500)Founded year1970Websitetecnisco.comLinkedIn profileLinkedIn

Verified contacts

16

available on Kipplo

LinkedIn employees

15

201 to 500 range

Open roles

no listings

Distinct roles

14

indexed titles

Tech stack

2

tools in use

Monthly traffic

30

organic / mo

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Top roles at Tecnisco, Ltd

14 distinct titles indexed · top 10 shown.

  • 2account manager
  • 2salesperson
  • 1assistant manager-pvd
  • 1business development
  • 1business development manager
  • 1global marketing department
  • 1machines
  • 1manufacturing dept manager
  • 1president
  • 1research and development engineer
  • +4more titles

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