Texas Institute For Electronics

The Texas Institute for Electronics (TIE) is accelerating the future of 3D microsystems and redefining what’s possible in semiconductor manufacturing. Backed by $1.45B+ in combined investment from the U.S. Department of War and the State of Texas, TIE is building the nation’s first pure-play multi-material microsystems interconnect foundry — a platform designed for speed, scalability, and innovation. Our advanced mixed-material interconnect technologies and standardized EDA flows enable up to 100× improvements in microsystem performance over traditional 2D silicon designs.* TIE is also training the workforce that will drive this transformation. Our sq. ft. Semiconductor Training Center equips students, engineers, and technicians with hands-on experience in advanced manufacturing and analytics — ensuring a ready pipeline of talent for the semiconductor ecosystem. From AI and quantum to defense, healthcare, telecom, and automotive, TIE bridges research, development, and production — helping innovators move from idea to impact faster.*Based on DARPA’s anticipated improvement in multi-material 3DHI microsystem performance over standard 2D silicon microsystems.