Total Board Solutions

TBS has over 100+ years combined experience covering all aspects of design using a variety of manufacturing technologies. The markets we have served are many and varied; Satellite, telecommunications (base-stations and handset design), mobile communications, gas and oil, mil-aerospace and the automotive industry to name but a few. We have achieved the IPC Certified Interconnect Designer (CID) qualification – this qualification is based on the leading IPC standards for PCB design and is the only formal qualification for PCB design world-wide All TBS designers are conversant with the requirements and nuances of Analogue design Digital design Power Supply (LTM) RF – Stripline/Microstrip Mixed Signal design Microwave design High-power/voltage design High-speed design – Signal Integrity EMC/EMI Intrinsically safe operation This diverse range of customer requirements has meant that a wide range of board construction has been considered to provide the optimum solution for each requirement. As a result we have extensive knowledge when designing using Single sided Double sided Multilayer Flex Flexible-rigid Ceramic substrates (Thickfilm/thinkfilm Hybrid design) Exotic materials – Polyimide, PVC etc The board construction is just one part of the manufacturing requirement; the assembly and component mounting schemes also drive the final solution. As such we also have the required skills when dealing with Through hole Component MD Components BGAs, µBGAs and LGAs µVias, blind and buried vias CSPs Flip-chip Bare-die LGA (Land Grid Arrays) LTM Power Devices Our aim is to provide the right solution to you at the right time. We pride ourselves on being able to match the right design, fabrication and assembly techniques to deliver a cost effective solution for both your prototype and production needs. When designing any PCB we always consider the DFM (Design For Manufacture), DFA (Design For Assembly) and DFT (Design For Test) requirements as a matter of course – our strong lin