Xingr Technologies

Probing The Future" XingR is a leading semiconductor company specializing in the design, development, and manufacturing of probe cards for chip functionality testing. With over 30 years of experience, our dedicated R&D and manufacturing team is committed to delivering reliable products to our customers every day. Comprehensive and Advanced Probe Cards: XingR offers a full range of technologies, including MEMS, cantilever, membrane, vertical probe cards, and substrates for high-speed, high-power wafer-level testing. Our solutions serve a wide variety of applications, including advanced SoC, ASIC, DDI, CIS, AI, AR/VR, Automotive, 5G/6G, and Data-Center. Global Presence: We operate 21 localized service points worldwide, ensuring timely problem resolution and reducing production and shipping costs through multiple manufacturing locations, including the US, Taiwan, China, Malaysia, and Vietnam. Patented Technology and Quality Assurance: Our core patent technology and standardized processes ensure quality assurance. Over the past 25 years, we have accumulated over 90 intellectual property rights, global customer resources, confidentiality controls, and agile services, making XingR an innovator in the probe card industry today. We are committed to excellence and innovation, continuously “Probing the Future.”