Yangtze Memory Technologies

Yangtze Memory Technologies Co, Ltd.(“YMTC”), established in Wuhan, China in July 2016, is an IDM memory company focusing on the design, production, and sales of 3D NAND flash memory. YMTC provides 3D NAND wafer, die, and solutions including embedded memory, cSSD, and eSSD for a wide range of applications including mobile devices, PCs, and data centers. In October 2017, YMTC successfully designed and manufactured China's first 3D NAND flash memory by combining independent R&D and international cooperation. In September 2019, 64-layer TLC 3D NAND flash memory with innovative Xtacking® architecture was officially put into mass-production. April 2020, YMTC has announced its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform, achieved the highest bit density, highest I/O speed and highest capacity so far among all released flash memory parts in the industry. YMTC has R&D centers in Wuhan, Shanghai, Beijing and other places. There are more than employees worldwide, including about 2,200 R&D engineers. YMTC is committed to becoming a global leading NAND flash memory solution provider through persistent efforts and technical innovations.