Alexander Balu

Senior Silicon Advanced Packaging Equipment Engineer at Intel

Based in Phoenix, United States

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Seniority

Staff

Department

Engineering

Location

Phoenix

Industry

Semiconductor Manufacturing

Company size

107K

Contact information

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Email

1 credit

a•••••••@intel.com

Phone

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Background

About Alexander Balu

Over 4 years of wafer and singulated die bonding equipment engineer experience supported by a background of 8 years as a Naval Nuclear Steam Plant Mechanical Operator/Technician and 2 years of graduate engine research. Equipment engineer experience includes project management, process engineering, pathfinding, and next generation equipment development (including work in wafer and substrate thermal compression bonders (TCB) and first of a kind formic-acid (FA) TCB equipment). Track record of success in managing engineering projects which include interfacing with suppliers, equipment HW/SW requirements definition, process development, line bring-up, Supplier and Factory Acceptance Testing (SAT/FAT) and high-volume manufacturing technology transfer. Committed to seeking opportunities for promoting continuous improvement of efficiency, output, safety, quality, and cost.

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Alexander Balu Email & Phone Number @ Intel | Kipplo Discover