Andrew Fan

Background

About Andrew Fan

20+ years thermal design experience across Laptop, Telecom equipment, Data center IT equipment. Solid thermal design capability for Server/storage, networking switch (TOR switch and ~14U modular switch) from board level, chassis level to rack level. Familiar with data center thermal management. • 10+ years team management experience in charge of thermal and reliability engineering department of 50+ Engineers in both Shanghai and Malaysia. Rich experience in program management, Talent development and mentoring, cross-function collaboration and technical presentation. • 10+ years thermal expert role leading thermal architecture design, thermal technology roadmap development, thermal design procedure & guideline establishment to standardize thermal design process for quality and efficiency improvement • Rich experience in Jointed design development with Tier 1 IT equipment OEMs(IBM, EMC,Juniper,Dell,Hitachi,etc) and ISPs(Facebook,AWS,etc) to meet their thermal requirement and expectation • Strong technical capability in natural convection cooling and forced air cooling, closed-loop & open-loop liquid cooling system design technology and key components such as micro-channel cold plate design, Keep tracking industry leading cooling technology and trend like immersion cooling, embedded liquid cooling for 3D chipset • Strong design capability and experience in complex heat sink including heat pipe or VC based as well as integrated heat sink for multiple chipsets cooling • Proficient in Flotherm, FloEFD for thermal simulation analysis, hands-on experience in transient analysis like Fan tray service time prediction, Average simulation error <5% • Certain experience in mechanical design. Familiar with sheet metal/plastic design and manufacturing process, experience with Pro/E and Creo • Strong thinking of innovation and innovation ability. 20+ patents granted(Including 5 US patents), 5 papers published