Andrew Ho

Background

About Andrew Ho

Proven cross-functional leadership in driving Product Development Lifecycles from 15+ years of experience in leading various Xeon® Servers collaterals & tools development across various groups at Intel as well as OxM training & OxM technical support. Additional 7+ years of experience in server supplier/ODM/CM business and technical management. Broad server hardware industrial experience spanning from supplier to OxM to End-User. Bridges the gap between engineering and business needs. Languages: English & Cantonese (native proficiency), Mandarin (limited working proficiency), Shanghainese (elementary proficiency) Technical Specialties:| Processor/Memory/Chipset Power/Thermal Architecture | TDP | Xeon® Platform Level Processor/Memory Power/Thermal Management | JMP Pro 11| White Paper | Technical Writing | Product Collateral Definition | Specification & Characterization | Program Management Specialties:| Thermal/Mechanical/SW Engineering Project Management | External Customer Communications (written, verbal, presentation)| Product Life Cycle Management | New Product Introduction and Ramp (NPI/NPR)| Cross Functional Teams | Customer Relations | Lean Six Sigma| Biweekly Internal Status Meeting | Biweekly Customer Meeting | Server Design-Win Sourcing Specialties:| Sourcing Leadership | Contract Negotiation | Schedule & Risk Management | CM/ODM/Supplier Management | Should-Cost Model | Competitive Benchmarking | FEMA | Supplier Financial Analysis | Supplier Audit | Root-Cause Analysis | RFQ | NPI Coordination | Continuity of Supply | Product Ramp | FAI | BOM Management | Forecasting