Andy Tseng

Sr Manager, Program Management at Amd

Based in Taiwan

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Seniority

Manager

Department

Operations

Location

Taiwan

Industry

Semiconductor Manufacturing

Company size

48K

Contact information

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Email

1 credit

a•••••••@amd.com

Phone

5 credits

+886 ••• •••• ••••

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Background

About Andy Tseng

20+ years computer industry professional background in notebook, desktop and server products.Experienced Program Manager/Project Manager/Core Team with a proven track record of successfully completing complex, customer focused hardware and software engineering programs. Proactively to pursue new technology and innovation to improve working process and cost saving.Effectively and aggressively lead internal teams to produce bottom-line results by blending technical management with strong interpersonal and organizational skills.Experiences:• Channel motherboard Customer PM (14nm/7nm AM4/AM5)• Channel Workstation CPM/PL/CRM (7nm WRX80 and next generation)• HEDT high end desktop Core Team CRM (14nm/7nm TRX40 Threadripper and next generation)• HP commercial Notebook and Desktop Customer PM• HP consumer and commercial Desktop Customer PM• Server Technical PM and Client Core Team CRM• AMD AM4 SOC/Promontory chipset Core Team CRM• AMD Kaveri/Carrizo APU Core Team CRMSpecialties:• Improved process : automation watermark utility to save ~$100K USD human hours cost per year• Creative idea to save ~$350K USD cost in CRB planning per year• Phase in new sample ordering system to next generation APU• Win 8.1 launch tiger Team• Lean Six Sigma Green Belt certification• VP Spotlight awards for AM4/TR4/TR4+ in 2017~2020• VP Spotlight award for G34 Magny-Cours launch in 2010• VP Spotlight award for rev F Barcelona launch in 2007• Cebit 2006 BenQ notebook booth representative• Won simplified process activity premium prize in Acer• 2004 ING Taipei Marathon 9km certificationPatents :• TW Patent 162931, 188202, M249397, I229818, 552552, 501006, 200825894, 200735662, 200519747• US Patent App. 20080129890, 20050144613, 20050107900• CN Patent 200610172116.9, 200610059102.6, 200320100676.5, 200310122587.5, 02119367.3, 01102599.9

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