Annabeth Yang

Advanced Packaging Development Technology R & d Engineer - Cvd Pvd Dry Etch Reflow at Micron Technology

Based in London, United Kingdom

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Seniority

Other

Department

Other

Location

London

Industry

Semiconductor Manufacturing

Company size

36K

Contact information

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Email

1 credit

a•••••••@micron.com

Phone

5 credits

+44 ••• •••• ••••

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Background

About Annabeth Yang

An MSc graduate in Advanced Materials Science and Engineering at Imperial College…

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