Baosuo Zhou

Background

About Baosuo Zhou

Principle engineer and engineering manager at Intel, defining roadmaps, strategy and solution paths, and leading the efforts across sites including supplier engagement to drive hardware and process solutions for 3D NAND high aspect ratio etch. Past experience:Senior member of technical staff at Applied Materials, leading the efforts in defending and penetrating critical DRAM and 3D NAND etch applications.Sr. Staff process engineer at Lam Research, responsible for developing advanced etch processes for leading edge logic and memory applications, new etch tool development and productivity solutions. Senior etch process engineer for developing advanced patterning technologies for memory products at Micron Technology.Intensive and extensive experience in developing and deploying conductor and dielectric etching technologies for leading-edge memory and logic applicationsExpertise in patterning technology. Developed a novel, low cost double patterning (pitch reduction) process flow successfully used in manufacturing of leading edge memory products (NAND, DRAM) at MicronExcellent problem solving skills, project management experience, and communication skillsTeam player with solid track record in collaborating with various technical teamsFluency in applied statistics including DOE and SPCResult oriented, ready for challenges