Behnam Garakani
R & d Electronic Packaging Engineer at Intel
Based in Phoenix, United States
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Seniority
Staff
Department
Engineering
Location
Phoenix
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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b•••••••@intel.com
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Background
About Behnam Garakani
A highly professional Materials scientist skilled in Materials characterization, Electronic Packaging, Process development, and Reliability Analysis. Has enormous experience in studying the microstructure, chemical, and electromechanical properties of various materials, including nanocomposites and semiconductors to develop new products and improve the performance and functionality of various types of structural and sensory materials. Recognized for professionalism, creative thinking, strong problem-solving, and demonstrated communication ability and technical presentation.
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