Benjamin Saack

Ltd Module Engineer at Intel Corporation

Based in Hillsboro, United States

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Seniority

Staff

Department

Engineering

Location

Hillsboro

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

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b•••••••@intel.com

Phone

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Background

About Benjamin Saack

I graduated with my BS in Physics in 2020 and my MS in Physics summer 2022. I received Special Recognition in Graduate Studies for outstanding academic performance, having maintained a 3.92 GPA throughout my graduate coursework. My initial exposure to laboratory processes and metrology techniques was in academic labs spanning materials science, chemistry, engineering, and physics departments. In undergrad, I became familiar with HV and UHV environments and had my first exposure to DC magnetron sputter deposition. This is also where I first encountered optical concepts and various metrology techniques for analyzing coating quality. Graduate school added to this experience as I delved deeply into the quantum electrodynamics of superconductivity. This greatly strengthened my solid state physics and materials science understanding and allowed me to hone my lab skills through repetition and rigorous data analysis. Since then, my skillset has continued to expand. I have become proficient in a wide array of lab techniques, instrumentation, and VLSI practices. From process engineering, to hands on wrench turning and metrology I am well equipped to get the job done. As time goes on, my full time work as a process engineer working with a variety of plasma based processes only serves to strengthen and build upon this foundation.

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