Bohan Shan
Technologist, Advanced Packaging R & d at Intel
Based in Tempe, United States
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Seniority
Staff
Department
Science
Location
Tempe
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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b•••••••@intel.com
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Background
About Bohan Shan
Intel ATD Technologist with 5+ years of experience in advanced packaging R&D, specializing in materials/process integration, packaging architecture, and co-packaged optics (CPO) development. Led the end-to-end development of critical packaging materials for Intel’s CPO platform and directly contributed to product roadmap definition and architecture feasibility. Proven track record of cross-functional leadership across design, materials, WLA/PLA, and substrate engineering teams. Accomplished inventor with 100+ U.S. issued and pending patents spanning IC packaging architectures, advanced assembly processes, and novel materials platforms.
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