Brandon Farber

Background

About Brandon Farber

As an undergraduate student at Purdue University, I am passionate about pursuing a career in the semiconductor industry. I have a strong academic background in mathematics, physics, and robotics, as well as a keen interest in music. I have also gained valuable hands-on experience in the audio industry through an internship at The Audio of Things, a company that develops innovative solutions for sound quality and performance. In this internship, I worked on various projects, such as packaging a product, managing microphone inventory, testing speakers, and fixing a 3D printer. I learned important skills in designing for manufacturability and feasibility, as well as testing and analyzing RF signals. I also demonstrated my creativity, problem-solving, and teamwork abilities, as I collaborated with engineers and technicians on challenging tasks and delivered high-quality results. I am eager to apply my skills and knowledge to new opportunities and challenges in the audio engineering field. Currently I'm researching the applications of Lean Six Sigma methodology in the semiconductor industry. This has provided me with great insight into the inner workings of the semiconductor industry, and has bolstered my interest in the area. In Spring 2025 I am joining the Semiconductors@Birck VIP team, where I look forward to advancing semiconductor technology through high level research.