Brian Chen
Micro Assembly Process Engineer at Formfactor Inc
Based in Livermore, United States
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Seniority
Other
Department
Other
Location
Livermore
Industry
Semiconductor Manufacturing
Company size
1.8K
Contact information
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b•••••••@formfactor.com
Phone
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Background
About Brian Chen
I am Brian Chen, graduated from Kaohsiung University of Applied Sciences with a B.S.E. in Mold and Die Engineering. A Field Application Engineer at Technoprobe. In charge of Probe card maintenance and repair in TSMC. Experience in dealing with customers.
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