Brian Erwin

Engineer, Packaging Failure Analysis & Diagnostics at Ibm

Based in Millbrook, United States

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Seniority

Other

Department

Other

Location

Millbrook

Industry

IT Services and IT Consulting

Company size

345K

Contact information

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Email

1 credit

b•••••••@ibm.com

Phone

5 credits

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Background

About Brian Erwin

My career is focused on creativity applying research, analysis, and engineering to solve…

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