Charles Arvin

Background

About Charles Arvin

Charles is a chemical engineer PhD scientist with over 20-years of experience as an industry leading electrochemist and a subject matter expert in the microelectronics and data center industry related to advanced packaging and systems connectivity. Innovation and ability to collaborate and lead partner discussions are crucial to deliver the next generation products on time and within budget. Charles has consistently delivered successfully on each program generation through leverage of his experience as a prolific innovator with over 160 patents in semiconductor packaging and as a key technology developer to tackle challenges and provide optimal packaging solutions. Charles routinely identifies technology that can be used across platforms and extendable for multiple generations. These applications included high speed signals within systems, advanced high power packages to support AI hardware requirements as well as those for hybrid cloud architectures. As the Advanced Packaging Interconnect Architect within IBM, Charles has expanded his role from execution to strategic architectural definition of advanced packaging solutions that allows for capacity / performance growth required to meet the needs of IBM's future Systems while collaborating with foundry and other industry partners. With the challenges around chip scaling, reticle size limiting incremental processor performance improvement and the advent of artificial intelligence (AI), the entire semiconductor industry is looking to advanced packaging co-designed with full system connectivity as the next frontier to drive performance. To sustain the differentiated and generation-to-generation performance growth expected by clients, delivering advanced packaging technologies are critical for future sales. Charles is distinctively positioned to lead this mission.