Christian Tocco

Background

About Christian Tocco

20 + years in automotive MFG and engineering management - from stamping dies both structural and class A products/ parts (FUJI TECKNIKA - HIROTEC AMERICA - EDAG USA) to assembly systems process concepts, engineering and PE/PM. Have done MIG, Resistance, PW, DAW, SPR, Robotic Roller Hemming (RRH) and other types of joining applications (MARTINREA/GM/EDAG/HIROTEC/TAKATSU/DTG) joining systems. Capable of FULL VERTICAL management - have managed Stamping dies / Hem dies to assembly systems to provide full systems based on the final assembly result not just the single panels. Have done process engineering and generation of man machine info, budget generation for required capitol and tooling equipment for the generation of CAPEX and spend plans. Capable to manage and the establishment of full SPEND PLAN and checkbooks. can generate SOWs, RFQs and performs quotation rounds to place systems for mfg. Can generate system timelines, open issues, eng changes and all program management related documents and data. To design management, vendor build and run at rate data collection and verification to buy off and home line installation and PPAP. Full turn key management capable every facet. Have managed cradle to grave major stamping and assembly line systems with full internal company and vendor cross discipline management - with budget and expenditure and engineering change management Travel internationally as well as internally USA. can speak Japanese (though pretty rusty at this point) and a little Spanish lived in Japan for 2 years on stamping die apprenticeship where I learned how to build and tryout stamping dies. Spent 5 months in double action draw press where I learned the basics of binder development and formability. hoping to find the last stop in my career. thanks so much