Christopher Koay

Background

About Christopher Koay

10 years working experiences in both IDM and FAB as Senior Failure Analysis Engineer. Working on failure analysis from production and customer return products by doing EFA fault isolation to PFA. Identifying the defect that cause the product failure. Work closely with the Product & Test team to resolve defectivity issues based on wafer failing signature, parametric data. Establish hypothesis of possible electrical or process fail mechanism based on electrical data, wafer failing signature, tool chamber matching and physical FA characteristic in order to continue support process improvement. Responsible for FA support includes TEM X-sec on Fab rejected wafer for yield enhancement, quality & reliability, failure characterization as well as customer return failure from EFI/EFA (Electrical test bench verification, Fault Isolation, PVC) to PFA (layer by layer de-processing, RIE, chemical etching, progressive-FIB milling, TEM X-sec cutting) in order for root cause determination. Hand on skills/experiences: Test correlation using Tester, SEM, IREM, Photo emission (PEM), OBIRCH, layer by layer de-processing, TEM cross-sectional sample preparation, progressive FIB milling, EDX analysis, Probing, Microscopy, RIE, Circuit & Layout analysis.