Colin M.
Regional Director Apac Representative Director Japan Beemotion Ai at Beemotion.Ai
Based in Yokohama, Japan
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Seniority
Other
Department
Other
Location
Yokohama
Industry
Embedded Software Products
Company size
12
Contact information
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c•••••••@beemotion.ai
Phone
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Background
About Colin M.
International technology business professional with over 30 years management, sales, marketing, engineering and operations experience. Business areas include Artificial Intelligence, Semiconductor, Electronics, Mobile, Wireless, Embedded Systems, Smart Grid & Software related to these (including Embedded, EDA, SAAS, Web Apps). Proven experience of successful launch & operation of new business in Japan/APAC. Direct sales experience for S/W, H/W, devices & design services, including complex "solution sales". Japan/APAC sales team & distribution channel management. Over 30 years Japan business experience, more than 25 living in-country. 14 with a major Japanese multinational & over 20 years running foreign capital firms' Japan businesses. 15 years running APAC business as region VP. Experienced manager of cross functional teams & technical/business operations. Fully versed in all matters related to running a business in Japan, with a deep understanding of the complexities of working between a foreign capital firm’s HQ management team and local staff, customers, channels & partners. Extensive network of customers including mobile, wireless, consumer, industrial, energy & automotive. Highly developed executive network in industry, business, investment, government & academic communities. Broad experience in market research, business planning & execution. Also market-entry/expansion/partnership for a wide range of products & industries. Wide experience of alliance/JV partnering. Includes identifying opportunity, negotiating agreements and implementing strategy. Strong technical background in R&D/apps/manufacturing/approval to complement management/sales/marketing skills. Specific technical knowledge of a wide range of software (including I, Embedded, EDA, SAAS, Web Apps), semiconductor devices, embedded systems, mobile wireless, wireless sensor networks, energy management systems, imaging and IC-card.
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