Connor Sorrells

Background

About Connor Sorrells

Connor is the primary power device Failure Analysis engineer at Microchip Technology’s Chandler, AZ headquarters. He has been working towards the development and advancement of the team’s FA capabilities for silicon and silicon carbide power devices over the past several years. His efforts range from workflow/procedure development, to business unit process integration, to innovative research on new techniques for the industry. Most recently, Connor had the privilege of serving as the lead author on a collaborative white paper publication with JIACO Instruments to illustrate the potency of using MIP (Microwave Induced Plasma) to decapsulate power devices that have undergone thermal modification - a process that often renders the encapsulant impervious to conventional wet chemistry. Connor is committed to helping Microchip Technology become an industry leader in robust power device products and Failure Analysis.