Corey Petroff
R & d Packaging Engineer at Intel Corporation
Based in Gilbert, United States
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Seniority
Staff
Department
Engineering
Location
Gilbert
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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c•••••••@intel.com
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Background
About Corey Petroff
Chemical engineer with proven expertise in problem solving, product manufacturing, cost reduction implementation, equipment development and platform validation. Proficient with SPC control, data analysis and key control indicator definition. Extensive knowledge in wet etch, advanced packaging and supplier development/management. Disciplined in SOP documentation and knowledge transfer. Leader who enjoys learning and training those who wish to learn.
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