Dave Polistico

Background

About Dave Polistico

As an electronics engineer with experience in die-level failure analysis, I was able to contribute my full potential in everything that the work requires me to do. I work and coordinate with several teams (design, test engineering, QA and others) in the company in order execute what is needed for failure and root cause analysis. Seeking for personal skills development aside from what the job requires me to do through self-paced training on different laboratory equipment available that would help to improve failure analysis techniques and methods.TECHNICAL SKILLS Non-destructive Analysis: Low/High Magnification Optical Microscope; Dimensional Analysis; 2D/3D X-ray; Scanning Acoustic Microscopy (SAM); SEM Inspection Electrical Analysis: Curve Trace Test; Bench Test; ATE Test Result Interpretation; Source/Measure Unit; Semiconductor Parametric Analyzer (SPA); Oscilloscope; Current Probes; Electric and WinSpice Software. Automated Curve Trace Testing.Fault Isolation: Emission Microscopy (EMMI); Thermal Hotspot Imaging; Liquid Crystal Analysis (LCA); Optical Beam Induced Resistance Change (OBIRCH); Laser Scanning Optical Microscopy (LSOM); Passive Voltage Contrast (PVC); Microprobing. Destructive Analysis: Chemical Deprocessing; Parallel Lapping; Mechanical Cross Section Polishing; Reactive Ion Etching (RIE); X-prep; Laser Ablation; Chemical Decapsulation; Mechanical and Chemical Backside Decapsulation Techniques; Laser Cutting; Etching ChemistriesDesign Tools: Cadence; L-edit; Mentor; Avalon LTSpice; ElectricOthers: Mounting/Demounting; Soldering; Technical Report Writing; Knowledge on Failure Modes and Failure Mechanism on Integrated Circuits; Failure Analysis Process Flow; EDX Analysis