Don Pakbaz

Background

About Don Pakbaz

Twenty plus years of experience as an electrical engineer with progressive responsibilities and a proven record of accomplishments in the computing and ASIC industries. Extensive experience in signal integrity and power distribution design for high-speed low-cost links at package, board and system level. Experienced with circuit simulator as well as modeling and system level simulation tools. Proficient in chip-package co-design to meet desired specifications as well as numerical and experimental tools/method for RF/microwave. Actively participated in the customization of package image, package selection process, and component selection at the system level. Excellent team work experience with active collaborations involving IBM packaging community, Analog core design team (PLLs, Oscillators and USB PHY) and Behavioral and Macro Modeling team. Contributor to development of IBM Noise Skill Team(INST) and IBM High Speed Skill Team(IHSST). Adjunct professor at University of Vermont (UVM) and Vermont Technical Collage(VTC) teaching courses in Signal Integrity and Control System disciplines.