Dwayne Wasylyshyn

Background

About Dwayne Wasylyshyn

I am a materials engineer that has spent the most part of 25 years in the high-tech consumer electronics industry. I've run projects to quantify and characterize the fracture behaviour of PCB laminates in drop, the variability of NCVM RF transparency and the tuning of antenna substrates for better performance. From the reliability side, I've lead DFMEA sessions during product development as well as investigations into the failure modes found in reliability tests or field returns. Everything from decorative processes, optical components, RF shielding gaskets, antenna assemblies and electrical connections. I find that it's not always about explicitly knowing the "why" down to the molecular level (ie limit to the 5 "whys"), but also knowing that such limits or failure modes exist and whether or not they can be accommodated through better design, process or material selection."Will it be ok in my application?"; That's what I love to do; Collaborate with teams to determine what is required, how can we quantify suitability for use and how can we qualify the design for mass production?"Why did this fail, and how was it missed in development?" This can be the case when multidisciplinary teams are working on bleeding edge technology. excessive line fall-out, reliability failures, or possibly even field failures. It's imperative to get all teams focused on root cause analysis, DOEs, and corrective actions to fine tune such things out as quickly as possible. I've scaled teams up and I've guided cross functional teams to help de-risk designs as early in the process as possible. From small organizations to large, I preach collaboration with cross functional teams and quality of support.