Eduardo de Mesa

Package Engineer at Intel Corporation

Based in Munich, Germany

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Seniority

Other

Department

Other

Location

Munich

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

1 credit

e•••••••@intel.com

Phone

5 credits

+49 ••• •••• ••••

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Background

About Eduardo de Mesa

An accomplished Process / Packaging Engineer with a comprehensive years of experience in…

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