Gaurav Singhal
Ltd Module and Integration Yield Engineer at Intel Corporation
Based in Champaign, United States
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Seniority
Staff
Department
Information Technology
Location
Champaign
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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g•••••••@intel.com
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Background
About Gaurav Singhal
I completed my dissertation with focus on fabrication and characterization of nano/micro porous copper 3D architectures using optical methods like proximity field nano-patterning (PnP)/ interference lithography. My research aims to address the existing problem of power management in semiconductor devices by enhancing the thermal conductivity and reducing the electrical resistivity of copper films. I have over six years of experience in working with industry partners like Toyota Research Institute of North America and Dow Chemicals on various projects related to ceramic materials, and polyurethane blends. I have developed skills in cleanroom fabrication, lithography process (photo, e-beam, interference), laser optics, nanomaterials, FDTD Lumerical, Python, and electrodeposition processes of copper, polymers, and composite materials. I have also gained an in-depth understanding of characterization methods like FTIR, Raman spectroscopy, DSC, SEM, FIB, and optical profilometry. I have published multiple papers in reputed journals and obtained patents for my innovative methods and systems. I am passionate about advancing the field of materials science and engineering and contributing to the development of novel and sustainable solutions for society.
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