Guann Ren Wang

Background

About Guann Ren Wang

1.Process setup for wafer preparation of PoP/3DI/DCA/HBM2e assembly. 2.Evaluate the process windows and optimize process parameters. 3.Deep diving on the root cause and solution for the inline issues. 4.Yield detractor analysis for yield enhancement. Task Force Activities 1.CR1 Auto-shell system implement: Participate in the development of automation system, co-work with IT and simulate all kinds of possible condition. Finally past 5 type tools & 200 scenario tests and implement on production line. 2.Yield CIP: Improve 3DI product on CR1 Laser Groove and Wafer Saw process, reduce about 0.5% crack rate at Test yield. 3.Product Max-out: Enhance DCA products 33% UPH in dicing process and 3DI product 40% UPH in laser groove process. 4.Process Improvement: Reliability test failed improvement (On-going). Study and modify the recipe parameters received from APTD, no failed on the early test. Detailed Responsibility 1.3DI/HBM CR1 process area owner. Including Wafer Laser Groove, Wafer Saw, UV cure. 2.Process window evaluation and optimization for WPH improvement. 3.CR1 assembly process development and yield enhancement 4.Problem solving by applying DOE, FA, FMEA, 8D and SPC methodology. 5.Cross-function and cross-site BKM alignment and fan-out activities. 6.Coordinate audit activities for assembly processes and reply actions. 7.Qualify new machines and new materials to achieve same quality requirement.