Gulbagh Singh

Principal Engineer, Process Integration Development at Tsmc

Based in Tainan City, Taiwan

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Seniority

Staff

Department

Engineering

Location

Tainan City

Industry

Semiconductor Manufacturing

Company size

25K

Contact information

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Email

1 credit

g•••••••@tsmc.com

Phone

5 credits

+886 ••• •••• ••••

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Background

About Gulbagh Singh

6 years experience in a high-speed, high-throughput semiconductor manufacturing environment. Expertise in advance CMOS (Si & SOI) planer 28nm/40nm and FinFET 4nm/5nm production handling, technology development, technology transfer, project handling and leading. Implemented a number of new ideas for product yield, electrical performance and uniformity improvement. Have in-depth knowledge of process integration, semiconductor device physics, device characterizations and process tuning. Strong skills of data analysis, route cause finding, trouble-shooting. Innovative with new ideas to provide solutions for device and product level improvements, and have filed 25 US patents in last 4 year. Self-motivated, Independent professional with a keen interest in semiconductor and a proven record of expertise in process integration development. Good Communication skills: English (Fluent), Hindi (Fluent), Punjabi (Native), Mandarin Chinese (Basic), Odia (Basic).

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